2-Stage HDI Rigid-Flex Board

An 8-layer rigid-flex PCB with 2-stage HDI construction, combining S1000-2MB rigid material and IF-2LD flex laminate at 1.65±0.15mm total thickness with ENIG finish. The 2-stage HDI stack uses sequential laser microvias to deliver fine-pitch BGA breakout and high routing density on the rigid sections, while the flex transition allows the assembly to fold inside compact mobile and telecom enclosures. Typical applications include 5G modules with active phased-array front-ends, foldable consumer devices, smartwatch main boards, and high-density telecom subassemblies. Manufacturing involves two sequential lamination cycles for the HDI stack-up plus controlled-depth registration between rigid and flex zones. The combination of stacked microvias and rigid-flex topology supports impedance-controlled high-speed lanes alongside bend-tolerant signal paths between subsystems.