0.3mm Thin Circuit Board

A 2-layer ultra-thin rigid PCB with overall plate thickness of 0.3mm, ENIG surface finish, and minimum copper hole diameter of 0.20mm at a 1.00:1 plate-thickness-to-aperture ratio. The thin FR-4 construction provides 2-layer routing density inside an envelope that approaches the thickness of a credit card, suitable for cost-sensitive compact products that still require rigid-board assembly rather than full flex. Typical applications include card-form IoT modules, embedded smart-home control boards, ultra-thin consumer accessories, RFID and NFC tags, and small-form-factor wearable bus boards. ENIG delivers a flat, oxidation-resistant solder surface that supports fine-pitch SMD reflow and stable contact for spring-loaded probe testing. Manufacturing demands precise copper imaging, registration, and warpage control, as the thin core has little tolerance for process variation.