
An ultra-thin 1-layer flexible PCB with overall plate thickness of 0.12mm and immersion gold surface finish, designed for the most space-constrained electronic assemblies. The single-copper construction on extremely thin polyimide makes the board flexible enough to fold tightly around camera modules, battery packs, hinge regions of foldable devices, and inside ear-worn or skin-contact wearable housings. Immersion gold provides a flat, oxidation-resistant surface that withstands long shelf life and supports both fine-pitch SMD reflow and ZIF connector insertion. Typical applications include smartphone camera flex cables, foldable hinge interconnects, hearable device internal wiring, smart-ring bus boards, and miniature medical sensor leads. Manufacturing demands strict copper-thickness control, selective coverlay lamination, and laser-cut profile matching to the host enclosure routing path.
Specs
| Layers | 1 |
| Board Thickness | 0.12mm |
| Surface Finish | Immersion Gold |
Applications