The Introduction Of Anylayer High Density Interconnection

Characteristics

1.The core board is thin, generally within 0.1mm.

2.High wiring density

3.The distribution of hole layer is complicated

4.Long production process

5.Line widith/spacing is smal:50/50um-100/100um

Processing capability of Anylayer HDI laser drilling

Item

maximum

Normal

minimum

A

Upper hole diameters

0.125mm

0.1mm

0.075mm

B

Lower hole diameters

0.1mm

0.085mm

0.06mm

B/A

Upper and lower hole diameters

90%

80%