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2022 · 12 · 16

INDUSTRY

High-layer, Mechanical Blind Hole Processing Ability Of Sihui Fushi

High-layer

Published

December 16, 2022

Category

INDUSTRY

High-layer, Mechanical Blind Hole Processing Ability Of Sihui Fushi

High-layer

①Maximum 80 layers, maximum plate thickness 6.35MM, minimum drill bit 0.25MM, maximum hole diameter ratio 25.4:1

②multi-stage back drilling

③Surface Treatment: OSP, LF HASL (Sn-Ag-Cu/Sn-Ni-Cu), Immersion Gold, Electro gold plating,Immersion Tinmechanical blind hole

①Multi stage blind buried hole structure.

②High frequency high speed material, mixed compression structure of various materials.

View the original article on fsqualitypcb.com

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