High-layer
①Maximum 80 layers, maximum plate thickness 6.35MM, minimum drill bit 0.25MM, maximum hole diameter ratio 25.4:1
②multi-stage back drilling
③Surface Treatment: OSP, LF HASL (Sn-Ag-Cu/Sn-Ni-Cu), Immersion Gold, Electro gold plating,Immersion Tinmechanical blind hole
①Multi stage blind buried hole structure.
②High frequency high speed material, mixed compression structure of various materials.
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