We all know that without copper in the hole, it is impossible to conduct electricity, which must be avoided in PCB manufacturing. There are many types of situations that can cause copper to sink into the PCB hole, and during the process of PCB manufacturing, such as copper sinking, electroplating, drilling, film pressing, etching, etc., it is possible to cause copper to be absent in the hole. As is well known, the board needs to undergo pre-treatment work because some substrates may be affected by moisture, or some of the resin may not solidify properly when pressing the synthesized substrate. This can lead to poor drilling quality due to insufficient resin strength during drilling, resulting in excessive dust or rough hole walls, burrs in the hole, copper foil nail heads in the inner layer, and severe burrs in the empty hole, The length of the torn section in the fiberglass area is uneven. Otherwise, these issues will pose certain quality hazards to chemical copper. Especially after some multi-layer boards are laminated, there may also be poor resin curing in the substrate area of PP semi cured sheets, which can directly affect drilling and activation of copper deposition by removing adhesive residue. Pre-treatment issues of board. Some boards may absorb moisture and some of the resin may not solidify properly during the pressure synthesis of the substrate. This may result in poor drilling quality, excessive drilling contamination, or severe tearing of the resin on the hole wall during drilling. Therefore, necessary baking should be carried out during cutting. In addition, some multi-layer boards may also experience poor resin curing in the substrate area of PP semi cured sheets after lamination, which can directly affect drilling and activation of copper deposition by removing adhesive residue. The drilling condition is too poor, mainly manifested as: there is a lot of resin dust inside the hole, the hole wall is rough, and the hole mouth has serious burrs. Burrs in the hole, copper foil nail heads on the inner layer, and uneven length of the torn section in the glass fiber area can all pose certain quality hazards to chemical copper. In this regard, control can be carried out from the aspects of technology, equipment, testing, etc. To reduce the occurrence of defects. 1. Develop the correct treatment process. In the process of manufacturing PCB, it is necessary to develop the correct process flow, which must undergo strict testing and verification. 2. Choose high-quality consumables and equipment. Choose legitimate suppliers and high-quality equipment and consumables to ensure the quality of the copper deposition process, as well as the balance between production efficiency and cost control. 3. Optimize the copper deposition process. Adjust the copper sinking process flow and the formula of copper immersion solution to optimize the problem of no copper in the copper sinking hole, thereby improving the quality of copper in the copper sinking hole. 4. Strengthen quality inspection. For the PCB industry, quality testing is the key to ensuring production quality. It can strengthen testing procedures and strengthen supervision to ensure effective control of the internal quality of copper sinking holes. Sihui Fuji adheres to quality as its foothold, continuously strengthens management from various production factors such as human machine, materials, methods, and environment, and provides customers with high-quality products.
